Linuo Pharmaceutical Packaging Invites You to the 4th Glass Substrate and Advanced Packaging Industry Chain Summit

As Moore’s Law gradually approaches its physical limits, advanced packaging has become an important pathway to sustaining semiconductor performance improvement and enabling system integration. TGV technology is accelerating its transition from the laboratory to industrial application and is widely regarded by the industry as a key enabling technology for next-generation high-performance chip packaging.

From August 26 to 28, the 4th Glass Substrate and Advanced Packaging Industry Chain Summit will be held at Hall 7, Shenzhen World Exhibition & Convention Center, Bao’an New Hall. Linuo Pharmaceutical Packaging sincerely invites industry partners to join us for in-depth exchanges.

Leveraging more than 30 years of technical accumulation and industrialization capability in specialty glass new materials, Linuo Pharmaceutical Packaging has strategically expanded into the R&D and industrialization of glass substrates for advanced AI chip packaging. At this exhibition, we will showcase our independently controllable glass substrate product system and systematic technical achievements.

During the forum, Zhang Haipeng, R&D Director of Linuo Pharmaceutical Packaging, will deliver a keynote presentation titled “Opportunities and Challenges of Raw Glass Sheets for Advanced Packaging Substrates.” The presentation will focus on the industry background beyond Moore’s Law, provide an in-depth analysis of the strategic value and core technical bottlenecks of glass substrates, and systematically present Linuo Pharmaceutical Packaging’s full-chain technological breakthroughs, from formulation modification and digital twin melting to precision forming and stress control through graded annealing. Together with industry peers, we will explore future industry prospects and technology evolution trends.

Linuo Pharmaceutical Packaging looks forward to meeting you at Booth A19 to discuss cutting-edge technologies, explore cooperation opportunities, and jointly promote the high-quality development of the advanced packaging industry chain.