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August 26, 2026 On August 26, the 4th Glass Substrate and Advanced Packaging Industry Chain Summit officially opened in Shenzhen. As a benchmark industry event focusing on advanced packaging and glass materials technology, this forum brought together elites from industry, academia, and research to jointly explore the technological evolution and coordinated development path of the advanced packaging industry chain amid the AI computing power wave.
Linuo Pharmaceutical Packaging made a strong appearance with its full-scenario glass substrate solution for advanced AI chip packaging. Dr. Zhang Haipeng from the Glass Research Institute was invited to deliver a special presentation titled “Opportunities and Challenges of Raw Glass Sheets for Advanced Packaging Substrates,” sharing Linuo Pharmaceutical Packaging’s technical accumulation and industrial insights in the field of high-end specialty glass new materials.
At the event, Linuo Pharmaceutical Packaging’s R&D achievements in substrate raw glass sheets attracted many industry professionals for discussion and exchange. The solution focuses on the core stage of raw sheet formulation development. In response to the stringent performance requirements of substrate materials in advanced packaging scenarios, Linuo has developed a glass raw sheet technology solution featuring high flatness, high heat resistance, low expansion, and excellent high-frequency characteristics, providing material-side technical support for AI chip packaging substrates.
Currently, the rapid development of the AI industry continues to drive growing demand for chip computing power. Advanced packaging has become a core pathway to breaking through chip performance bottlenecks and improving computing power density. Glass substrates, with their outstanding thermal stability, dimensional accuracy, and dielectric properties, are continuing to release greater industrial value.
Leveraging more than 30 years of technical accumulation and process experience in the specialty glass field, Linuo Pharmaceutical Packaging has precisely entered the glass substrate sector. Starting from the material source, the Company is advancing technical breakthroughs in substrate raw glass sheets through mature melting technology and full-process quality control experience. At present, Linuo Pharmaceutical Packaging’s relevant pilot line is operating steadily, continuously refining formulation processes and product performance, and steadily advancing technology iteration and process validation.
During the thematic sharing session, Dr. Zhang Haipeng started from the origin of materials and deeply analyzed the core positioning of raw glass sheets for glass substrates in the advanced packaging industry chain, as well as the current technical breakthrough directions of the industry. He pointed out that the explosive growth of AI computing power demand and the rapid iteration of advanced packaging technologies have opened up broad growth potential for the glass substrate industry. Domestic material companies are facing an important opportunity to deeply participate in the industry chain and promote domestic substitution.
At the same time, downstream application scenarios are placing increasingly higher requirements on indicators such as surface flatness, internal purity, coefficient of thermal expansion, and yield rate for large-size preparation of raw glass sheets. Material R&D capabilities and manufacturing processes remain the core barriers to industrial breakthroughs. In his presentation, Dr. Zhang Haipeng also introduced Linuo Pharmaceutical Packaging’s phased achievements in glass substrate formulation R&D and melting process optimization, demonstrating its technical strength in building a solid performance foundation from the raw sheet end.
From pharmaceutical packaging, heat-resistant glass, and life science to glass substrates, Linuo Pharmaceutical Packaging has always expanded its boundaries around the specialty glass new materials track. Relying on the professional R&D platform of the Glass Research Institute, the Company continues to tackle core technologies, building a complete R&D technology system for substrate raw glass sheets. With its forward-looking scientific and technological innovation capabilities, Linuo Pharmaceutical Packaging won the “Science and Technology Innovation Pioneer Award” at this forum.
The discussions in Shenzhen continue, and the next meeting will take place by the shore of Taihu Lake. From August 31 to September 2, the 2026 Integrated Circuit Innovation and Development Conference (Wuxi), themed “A New Chip Era, An Unbounded Industry Chain,” will be grandly held in Wuxi. The conference will bring together academicians, experts, leading enterprises, and investment institutions to conduct in-depth discussions around frontier topics such as artificial intelligence, advanced packaging, and automotive electronics. It is an annual benchmark event for the integrated circuit industry in the Yangtze River Delta.
At that time, Linuo Pharmaceutical Packaging’s full-scenario glass substrate solution for advanced AI chip packaging will be showcased at the exhibition, where the Company will join industry partners to explore innovative pathways for packaging materials in the AI era.
Produced by | Brand Center
Text Editor | Qi Jinlong
Image Source | Qi Jinlong
Responsible Editor | Mei Jinjiao
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