From August 31 to September 2, the 2026 Integrated Circuit (Wuxi) Innovation and Development Conference opened under the theme “A New World of Chips, Connected Without Boundaries.” The 14th Professional Exhibition for Semiconductor Equipment, Materials and Core Components was held concurrently.
The conference brought together leading representatives from government, industry, academia and research institutions. Liu Xiaotao, Governor of Jiangsu Province, attended the opening ceremony and joined Shi Yi, Academician of the Chinese Academy of Sciences, in unveiling the Jiangsu Integrated Circuit Industry Alliance.
Shen Jianrong, Vice Governor of Jiangsu Province; Du Xiaogang, Secretary of the CPC Wuxi Municipal Committee; and Guo Lili, Deputy Director-General of the Department of Electronic Information of the Ministry of Industry and Information Technology, delivered speeches. Ding Rongjun, Academician of the Chinese Academy of Engineering, and Zhao Jianjun, Secretary-General of the Jiangsu Provincial Government, attended the event. Jiang Feng, Mayor of Wuxi, presided over the opening ceremony.
At the exhibition, LINUO Pharmaceutical Packaging showcased glass sheets under pilot development for potential use in advanced AI chip packaging. Focusing on the key material segment of advanced packaging, the company attracted significant industry attention with its deep technical expertise and scenario-based product solutions.
As demand for AI computing power continues to grow, advanced chip packaging is rapidly evolving toward higher density, greater integration and higher reliability. Glass sheets are being explored as a potential base material for advanced packaging applications, including 2.5D/3D packaging and CoWoS.
Compared with conventional organic substrates, glass substrates offer a low coefficient of thermal expansion, ultra-high surface flatness and excellent electrical insulation performance. These properties can effectively address key challenges such as thermal mismatch and fine-line routing in high-computing-power chips.
Glass substrates are a critical foundational material supporting the continued advancement of AI chip computing power. Achieving greater domestic control over this material is essential to strengthening the integrated circuit industry chain and safeguarding supply chain security.
Drawing on the Linuo Group’s experience in specialty glass, LINUO Pharmaceutical Packaging is developing glass sheets for advanced semiconductor packaging, with the project currently at the pilot production stage. Its solutions are designed for AI chip packaging scenarios involving different process requirements, providing stable and reliable substrate support for high-computing-power chips.
With the continued advancement of its “1+2” strategy, the company is using new quality intelligent manufacturing to drive technological breakthroughs and promote the domestic substitution of key core materials, helping remove barriers to greater collaboration across the industrial chain.
Amid ongoing efforts to strengthen and reinforce the industrial chain, LINUO Pharmaceutical Packaging’s appearance at the exhibition represented a concentrated presentation of its glass substrate technologies and product innovation. It also reflected the company’s long-term commitment to connecting regional industrial innovation resources and jointly building an independently controllable industrial-chain ecosystem.
LINUO Pharmaceutical Packaging will remain focused on achieving breakthroughs in key strategic sectors. Through material innovation, the company will continue strengthening the foundation of advanced packaging, empowering the evolving world of chips and supporting greater integration and advancement across the entire industrial chain.
14 de septiembre de 2026 
