Building a Strong Substrate for a Far-Reaching Chip Future | LINUO Pharmaceutical Packaging Concludes a Successful Appearance at the 2026 Integrated Circuit (Wuxi) Innovation and Development Conference

From August 31 to September 2, the 2026 Integrated Circuit (Wuxi) Innovation and Development Conference opened under the theme “A New World of Chips, Connected Without Boundaries.” The 14th Professional Exhibition for Semiconductor Equipment, Materials and Core Components was held concurrently.

The conference brought together leading representatives from government, industry, academia and research institutions. Liu Xiaotao, Governor of Jiangsu Province, attended the opening ceremony and joined Shi Yi, Academician of the Chinese Academy of Sciences, in unveiling the Jiangsu Integrated Circuit Industry Alliance.

Shen Jianrong, Vice Governor of Jiangsu Province; Du Xiaogang, Secretary of the CPC Wuxi Municipal Committee; and Guo Lili, Deputy Director-General of the Department of Electronic Information of the Ministry of Industry and Information Technology, delivered speeches. Ding Rongjun, Academician of the Chinese Academy of Engineering, and Zhao Jianjun, Secretary-General of the Jiangsu Provincial Government, attended the event. Jiang Feng, Mayor of Wuxi, presided over the opening ceremony.

As a key force in the specialty glass sector, LINUO Pharmaceutical Packaging presented its full-scenario glass substrate solutions for advanced AI chip packaging at the exhibition. Focusing on the key material segment of advanced packaging, the company attracted significant industry attention with its deep technical expertise and scenario-based product solutions.

As demand for AI computing power continues to grow, advanced chip packaging is rapidly evolving toward higher density, greater integration and higher reliability. As a core substrate material capable of helping overcome technical bottlenecks in advanced technologies such as 2.5D/3D packaging and CoWoS, glass substrates are becoming increasingly strategically important.

Compared with conventional organic substrates, glass substrates offer a low coefficient of thermal expansion, ultra-high surface flatness and excellent electrical insulation performance. These properties can effectively address key challenges such as thermal mismatch and fine-line routing in high-computing-power chips.

Glass substrates are a critical foundational material supporting the continued advancement of AI chip computing power. Achieving greater domestic control over this material is essential to strengthening the integrated circuit industry chain and safeguarding supply chain security.

Building on more than 30 years of technical expertise in specialty glass, LINUO Pharmaceutical Packaging has established a strong presence in the advanced packaging glass substrate sector. Its solutions are designed for AI chip packaging scenarios involving different process requirements, providing stable and reliable substrate support for high-computing-power chips.

With the continued advancement of its “1+2” strategy, the company is using new quality intelligent manufacturing to drive technological breakthroughs and promote the domestic substitution of key core materials, helping remove barriers to greater collaboration across the industrial chain.

Amid ongoing efforts to strengthen and reinforce the industrial chain, LINUO Pharmaceutical Packaging’s appearance at the exhibition represented a concentrated presentation of its glass substrate technologies and product innovation. It also reflected the company’s long-term commitment to connecting regional industrial innovation resources and jointly building an independently controllable industrial-chain ecosystem.

LINUO Pharmaceutical Packaging will remain focused on achieving breakthroughs in key strategic sectors. Through material innovation, the company will continue strengthening the foundation of advanced packaging, empowering the evolving world of chips and supporting greater integration and advancement across the entire industrial chain.